- IBM announcing the discovery of the first new class of polymer materials in decades. Discovered using a combination of lab experiments and computer modelling, the new plastics have properties that could potentially have a huge impact in manufacturing, transportation, aerospace, and micro electronics.
- The IBM polymers consist of two related classes of plastic materials. They’re formed by combining paraformaldehyde and 4,4ʹ-oxydianiline in what’s called a condensation reaction. When heated to 250⁰ C (482⁰ F) the material becomes very strong as covalent bonds form and the solvent is forced out, forming the first of two versions of the polymer. Both versions are highly elastic, resistant to solvents, and are recyclable. One version can even self-heal.
- These polymers also show new physical properties. The first version is lightweight, stiff, resistant to cracking, shows more strength than bone, and can also turned into new polymer structures with half again as much strength. However, it is very brittle, like glass. When mixed with carbon nanofibers and heated, it forms an extremely strong, lightweight composite material that is similar to metal, yet has a degree of self-healing when cracked.
- Another version of the plastic forms an elastic gel because it’s formed at low temperature and traps the solvent in its molecular network. This gel is not only very stretchy, but It’s “self-healing” because if you cut a bit in two, they bond back together again in seconds when they touch. According to IBM, this property makes the gel polymer useful as an adhesive, a way of making other polymers self-healing, or as a method for transporting dyes or medicines.
- Both versions are also recyclable. Water doesn't affect the polymer, but when the water is acidic, the polymer melts and can be recovered and reformed into new products. This property means that the plastic can be selectively removed without affecting surrounding materials, which has great potential for the semiconductor industry, manufacturing, and advanced composites.
- This is unique to IBM and allows us to address the complex needs of advanced materials for applications in transportation, microelectronic or advanced manufacturing.
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